TECHNICAL PAPERS AND ARTICLES:
2000Plus_Entertainment.pdf
Book Review_Nano.pdf
The Next Generation_Military.pdf
2000Plus_Healthcare.pdf
When Worlds Collide.pdf
Virtuality 2084.pdf
3,000 Years of Photonics.pdf
3D Packaging 2002.pdf
4Way Underfill Race_2000.pdf
7000 Year Cycle.pdf
Alchemy of Nano_CT.pdf
APEX2000-WL-Underfill.pdf
Best Minimal Package.pdf
Area Array Packaging-2008.pdf
Braselton99_RFID.pdf
Catching the Big Wave.pdf
Chip Packaging 2 0.pdf
CondAdhesives_2001.pdf
Conversion_Circuit Process_CircuiTree.pdf
DiskDriveTechnology.pdf
ELEC_DESIGN_Mag_-MOEMS.pdf
Electronics Obsolete.pdf
Encapsulation_2004.pdf
ET Attack_2002.pdf
Final Revolution_2002.pdf
Flex History 2002.pdf
FlipChip_vs_CSP_2000.pdf
FlipChip_w_Cond-Adh_2000.pdf
Future is Plastics.pdf
Future of Medicine.pdf
GETTERS_HDI-2001.PDF
Getters-in Packaging.pdf
Gilleo0808_MEMS.pdf
Gilleo 7-09 rev2.pdf
Groove Circuits_CircuiTree.pdf
HDI Expo-Reworkable2.pdf
HDI_1999-RFID.pdf
Home Grown Circuits.pdf
How Old is Nano Imprinting.pdf
IMAPS98_Great UF Race.pdf
IMAPS98_UltimateCSP.pdf
Interpack_1999.pdf
IPC-Toron_MEMS-MOEMS.pdf
Is MEMS Still the Word_1.pdf
LowBall-Pack_SemiConWest04.pdf
MEMS Pack Chall - 2000.pdf
MEMS pack update-09.pdf
MEMS PKG ISSUES & MTLS.PDF
MEMS WLP-IWLPC05.pdf
MEMS_Challenges.pdf
MEMS_MOEMS_2001.pdf
MEMS_MOEMS_IMECE2000.pdf
MEMS_MOEMS_Photonics_2001.pdf
MEMS_Pack_IMAPS2000.pdf
MEMS_Pack-Assem_SMTAi-2000.pdf
Metalworking_ 21st Century.pdf
MID-Circuits.pdf
MOEMS_the_Word_2000_CA.pdf
Molded Plas Pack_SMTAi-2004.pdf
Molded Underfill_2000.pdf
Molded-Underfill_2000.pdf
Molding-2005-Jones-Gilleo.pdf
Moores HDD Law.pdf
NepWest98_Chemistry-Underfills.pdf
NepWest99_Wafer-level Underfill.pdf
Never Need Batteries EP&P.pdf
NEXT Big Event.pdf
Next Generation Circuits.pdf
Non-metal conductors.pdf
NSF-MEMS_WORKSHOP.pdf
Opto_v_Elec_2002.pdf
Optoelec_RIT_2002.pdf
-Optoelectronics_2002.pdf
Opto-history_IMAPS-Nordic2002.pdf
Packaging in 2001.pdf
Packaging Medical Electronics.pdf
PanPac2001_Packaging.pdf
PanPac 2003-Emerg-Tech.pdf
Past-Present-Future-FLEX.pdf
PCB Classification.pdf
Photonics-2001_SMTA.pdf
Photonics_2001.pdf
Plastic Pack_APEX-2003.pdf
Plastic Pack_APEX-2005.pdf
Plastic Pack_IMAPS_2003.pdf
Podcast_Ethanol.pdf
Podcast_Flex-Inner-Outer.pdf
Programmable Matter.pdf
REWORKABLE Polymers_HDI Expo.pdf
SHORT HISTORY OF FLIPPED CHIPS.pdf
SMI98_LowCost FlipChip_Flex.pdf
Solid Underfill_2000.pdf
System on Package-Review.pdf
The Future of Packaging.pdf
The Real e-Ticket.pdf
The Real Warbots.pdf
Thinking Out of the Hermetic Box.pdf
Ultra-High-Density Heads.pdf
Underflip-WUF.pdf
Verge to Converge_2002.pdf
Vertical Thinking.pdf
Will Assembly Disappear.pdf
Building BGAs.pdf
SITE_1987_Gilleo_Printed Electronics.pdf
SITE_1988_Gilleo_Anisotropic Adhes.pdf
SITE_1988_Gilleo_Printed-thru-Hole.pdf
SITE_1988_Gilleo_Soldering Mylar.pdf
SITE_1988_Print-vs_Photo.pdf
3-D Circuits_Have they Arrived.pdf
100 Jahre Leitterplatte_German.pdf
A Brief Three-Millenia History of Digital Wireless.pdf
A New Multilayer Circuit Process Based on Anisotropicity.pdf
A Simplified Multilayer Circuit Process.pdf
Adhesives-Epoxy Dispensing_2.pdf
Adhesives-Epoxy Dispensing_Step-by-Step.pdf
Advances in Packaging and Assembly Polymers.pdf
Are Polymer Solders Real_Metal_vs_Adhesive.pdf
Are Polymer Solders the Answer to Lead-Free Assembly.pdf
Area Array Chip Carrier_SMT Package for KGD_1993.pdf
Area Bonding Conductive Adhesive Preforms.pdf
Assembly with Conductive Adhesives.pdf
Breaking Moore\'s Memory Law.pdf
CHIP PACKAGING 2.0.pdf
Chip Scale or Flip Scale.pdf
Conductive Adhesives_Making the No-Lead Connection.pdf
Conductive Adhesives-The Way Forward.pdf
Convergence.pdf
Copper and PTF Merger.pdf
Definitive History of PCBs.pdf
Die Attachment for Todays Packaging Challenges.pdf
Early and Fascinating History of PCB.pdf
Electronic Polymers.pdf
Elemental_2002.pdf
Elements on Demand.pdf
ENCAPSULATION_AdvPack.pdf
Evaluating Polymer Solders for Lead-Free Assembly-Part I.pdf
Evaluating Polymer Solders for Lead-Free Assembly-Part II.pdf
Evolving Encapsulants.pdf
Expanding the Capability of Flexible Circuitry.pdf
Factoring in the Energy Factor.pdf
Final Revolution_2003.pdf
Flex in the Years 2000 Plus.pdf
Flex-Based Packages-Chip Carriers.pdf
Flex-Based Packaging Solutions _ CSP to MEMS.pdf
Flex-Based Packaging-Part 2.pdf
Flex-Based Packaging-Part 3.pdf
Flexible Printed Wiring-Versatile Connection System.pdf
Flip Chip 1,2,3.pdf
Flip Chip & Advanced SMT Assemby with PTF_IPC.pdf
Flip Chip Assembly with Condive Adhesives.pdf
Flip or Flop_Flipchip.pdf
Future Applications for MEMS-MOEMS Technology.pdf
Future Directions for TAB_1987.pdf
History of the Printed Circuit_CH1.pdf
Implementing SMT with Conductive Adhesives.pdf
Introduction to Conductive Adhesives.pdf
Is Electronics Obsolete.pdf
Lets Hear it for Groovy Circuits.pdf
MEMS Packaging Issues & Materials.pdf
MEMS Packaging Solutions.pdf
MOEMS the WORD-2000.pdf
Molded Underfill for Flip Chip in Package.pdf
Nanotech_Energy_Snakeoil.pdf
New Trends in Packaging_1995.pdf
Next Big Event_EP&P.pdf
Next Century of Printed Circuits_CH13.pdf
No Place to Go but Up.pdf
On the Verge of Converge.pdf
Optoelectronics_vs_Electronics.pdf
Organic Solders Take on New Shapes.pdf
Package-PCB_ Classification.pdf
Packaging Problems_Flex.pdf
PCB History_CH1.pdf
PCB History_Chip Carrier_CH4.pdf
PCB History_War_CH2.pdf
PCB History-Captives_CH11.pdf
PCB History-Chip Carrier_CH5.pdf
PCB History-Educators_CH12.pdf
PCB History-Eisler_CH3.pdf
PCB History-Flex_CH9.pdf
PCB History-Independents_CH6.pdf
PCB History-Molded_CH7.pdf
PCB History-Suppliers_CH8.pdf
PCBs, Semis and Nanotech.pdf
RF-MEMS.pdf
Plastics in Your Future.pdf
Polymer Bonding Systems Offer Alternatives to Soldering.pdf
Polymer Materials-Empowerment of Flip Chip.pdf
Polymer Systems for Connection-Interconnection.pdf
Polymer Thick Film (PTF) Circuits.pdf
Polymer Thick Film_PPR-96.pdf
POLY-SOLDER_A New Junction-Stable Conductive Adhesive.pdf
PTF Merges with Flexible Circuitry.pdf
PTF SMT and Flex-A Winning Combination.pdf
PTF Technology_Book.pdf
Putting the Flex Puzzle Together.pdf
Ready for MID.pdf
RFID Tags Enabled by Flip Chip.pdf
Rheology and Surface Chemistry for Screen Printing.pdf
Roll to Roll Hybrid Circuits.pdf
Search for a New Device Could Catalyze PCB Revolution.pdf
Sheldahl.pdf
SMT Chip Carrier.pdf
SMT_No Soldering_No Joke.pdf
SMT+Flex=Versatility.pdf
SMT-Flex-A Synergistic Solution.pdf
Solderless SMT Assembly_EXPO-SMT-1988.pdf
Stacking Silicon-The Race to TSV in 3D.pdf
Technology Update_Bleeding Edge.pdf
Telecom Revolution.pdf
The Chemist in Electronics.pdf
The Circuit Centennial.pdf
The First 7,000 Years of Soldering - Part I.pdf
The First 7,000 Years Part II.pdf
The MEMS PCB Assembly Challenge.pdf
The Next Generation_Circuits.pdf
The Other Circuit Process.pdf
The Packaging Revolution_BGAs CSPs and Flip Chip.pdf
The Polymer Electronics Revolution_NepconWest92.pdf
The Real e-Ticket_Moving the Window.pdf
The Real History of Chip on Flex.pdf
The Real Printed Electronics.pdf
The Robots Have Landed.pdf
The Time is Right for Injection Molded Packages.pdf
The First 105Years FlexibleCircuitry.pdf
Thermoplastic Adhesives _ Attachment Solution for Multichip Modules.pdf
Time to Give Flip Chip a Rest.pdf
Using SM Devices on Flexible Circuitry.pdf
Wafer-Level Flip Chip_Underflip.pdf
Whats Behind Flex Success.pdf
When Worlds Collide_Bleeding Edge.pdf
Worlds Best Minimal Package.pdf
Joining Materials_Past Present Future_Part1.pdf
Joining Materials_Past Present Future_Part II.pdf
Way Beyond Silicon_June2010.pdf
Area Array Packaging - Then and Now
The Future of Technology - 50 Years Ahead
The Sci-Fi Future of Medicine ... the Next 50 Years
The Alchemy of Nanotech
The Alchemy of Nanotech - Part II
Milestones in Packaging (notes)
Onward and Upward - from Pyramids to Blocks
The Enlightened Chip
The Future of Packaging
Big Nano Success Stories
Thermoplastic Injection Molding: New Packages and 3D Circuits
Thermoplastic Electronic Packaging: Low Cost – High Versatility
Heat Sink Materials
MEMS in Medicine
MEMS Packaging Update
Injection Molded & Micro Fabrication Electronic Packaging
Packaging Medical Electronics Products
Low Ball BGA: A New Concept in Thermoplastic Packaging
The Alchemy of Nanotechnology
The New Convergence
Time To Consider Thermoplastic Materials for Electronic Packaging
Underfill Update: Materials and Processes
Press Release: Wafer-Level Die Stacking and Assembly
Device/Package/PCB/System Technology Categories
Plastic Hermetic Packages for MEMS, MOEMS & Optoelectronic Devices?
Wafer-Level Flux-Underfill: Underflip!
MEMS & MOEMS Packaging Challenges
Overview of New Packages, Materials and Processes
RFID Tags Enabled by Flip Chip
The Circuit Centennial
Managing MOEMS
Newest Micropackaging Concepts Including MEMS & Photonics
Conductive Adhesives - The High Tech Solution in Medical Electronics
Flip Chip Assembly with Conductive Adhesives
Getters — Molecular Scavengers for Packaging
Flex-Based Packaging Solutions – from CSPs to MEMS
Materials and Processes for MR and GMR Heads and Assemblies
Ultra-High Density Magnetic Heads
Reworkable Packaging Materials – Die Attach & Underfills
The Great Underfill Race
Will Flip Chip Become the Ultimate CSP?
The First 147 Years of OptoElectronics
MEMS Challenge: Can This Technology Catch the Internet Lightwave?
Interposer Multilayer Circuitry
Nano-Hoax?
The Chemistry & Physics of Underfill
The Ultimate Flip Chip - Integrated Flux/Underfill
Can ET Pull Us Upward?
Optoelectronics - Adding a Little Light to the Nano-World
New Generation Underfills Power the 2nd Flip Chip Revolution
Transforming Flip Chip into CSP with Reworkable Wafer-Level Underfill
High Volume, Low Cost Flip Chip Assembly on Polyester Flex
Flexible Circuits - The Next 100 Years
When Are Conductive Adhesives an Alternative to Solders?
Polymer Solders: The Cool Lead-free Alternative?
Photons Bring the Big Events
MEMS Packaging & Assembly Issues
Will MEMS Become All Pervasive?
POWERPOINT PRESENTATION FILES:
ET-SUMMIT-09-Gilleo.ppt
ET-SUMMIT-09-Gilleo.pps
SMTA ET2008.ppt
Gilleo_MEMS-Nano2.ppt
Gilleo_MEMS-Nano3.ppt
Gilleo_MEMS-Nano4.ppt
Gilleo_MEMS-Nano5.ppt
Gilleo_MEMS-Nano7.ppt
Gilleo_MEMS-Nano8.ppt
Gilleo_MEMS-Nano9.ppt
Gilleo_MEMS-Nano10.ppt
Gilleo_MEMS-Nano1A.ppt
Gilleo_MEMS-Nano1B.ppt
Newest Micropackaging Concepts Including MEMS & Photonics (EtroniX 2001)
Ultra High-Density Magnetic Heads (IMAPS 2000)
MEMS Packaging Issues and Materials (IMAPS 2000)
Flip Chip Assembly with Conductive Adhesives (IMAPS 2000)
The Next Big Event - One Century - Catching the Next Wave (IMAPS Boxboro 2001)
Overview of New Packages, Materials & Processes (Opto-MOEMS 2001)
MEMS - Fab, Packaing, Assembly, & Connection (SEMICON West 2001)
Polymer Solders: The Cool Lead-Free Alternative (SMTA 2000)
MEMS Packaging & Assembly Issues (SMTAI 2000)
Transforming Flip Chip Back Into a CSP (Pan Pacific 1999)
MISCELLANEOUS FILES:
PUBLICATIONS & PRESENTATIONS FULL REFERENCE LIST: 1969 - PRESENT
PROFILE PUBLICATIONS DOWNLOADS CASE STUDIES FUTURE 50 MULTIMEDIA LINKS CONTACT HOME TOP BACK ET-Trends LLC, 16334 Patriot Way, West Greenwich, RI 02817
